EPPsys D
The reliable direct assembly in foamed materials
EJOT TSSD®
Specification
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Overview
- Fastening elements and processes specifically developed for joining in lightweight sandwich structures
- Wide range of materials and structures that can be joined
- Main application: thermoplastic or thermoset sandwich structures with honeycomb core
- Ideally suited for tolerance-independent assembly since no pre-hole is necessary
- High assembly reliability due to large margin between installation and stripping torque when combining with the EVO PT
- Weight savings and recyclability thanks to the use of plastic material
- Various diameters, lengths, and head geometries available
Sebastian Schrodt
Head of Sales EJOWELD
The EJOT TSSD thermal adhesive bonding boss
The EJOT TSSD® (thermal adhesive bonding boss) product and corresponding joining process have been developed with the objective to join components of which one is made of fibre-reinforced plastics.
The process is suitable for sandwich elements with honeycomb and foam core structures (having different top coats) as well as for CRP and GRP plastic materials.
During the joining process the plastic boss (made of thermoplastic) is installed into the plastic component with a certain rotation speed and axial load.
Further Products
EPPsys DR
Reliable snap-fit connections in foamed components
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